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通过示差扫描量热法（ＤＳＣ）和动态力学性能分析（ＤＭＡ）等方法，对改性ＢＭＩ树脂印刷电路板后处理工艺进行研究，根据ＤＳＣ测试原理导出动力学方程，经计算机处理的结果表明，改性ＢＭＩ树脂在２００Ｃ下后处理５小时得到固化程度达１００％，而ＤＭＡ试验显示树脂基体经２００℃下后处理１０小时才能充分固化。并且可以看出，低温条件下，固化效应与相应温度下损耗峰和固化网络部分链段运动有关。
Through the differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA) and other methods to study the post-treatment process of modified BMI resin printed circuit board, according to the DSC test principle derived kinetic equation, the results of computer processing, Post-treatment of the modified BMI resin at 200C for 5 hours gave a degree of cure of 100%, whereas the DMA test showed that the resin matrix was post-treated at 200 ° C for 10 hours to be fully cured. And it can be seen that under the condition of low temperature, the curing effect is related to the loss peak at the corresponding temperature and the movement of some segments of the solidifying network.