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针对带引脚表贴器件在热、振动条件下的互联疲劳寿命模型开展研究,通过将有限元法和失效机理模型结合建立了互联疲劳寿命分析方法流程;以四面扁平封装(QFP)为例进行了互联疲劳寿命计算,得出振动环境下的疲劳寿命为1.64×107个循环;在温度循环条件下危险焊料的疲劳寿命为3 512周。
Aiming at the interconnected fatigue life model of the pin-on-surface device under thermal and vibration conditions, the interconnection fatigue life analysis method flow was established by combining the finite element method and the failure mechanism model. The QFP The calculation of interconnect fatigue life shows that the fatigue life under vibration is 1.64 × 107 cycles, and the fatigue life of hazardous solder under temperature cycling is 3 512 weeks.