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目前,SiC薄膜在极端苛刻环境下的力学性质尚不明确,相关力学参数仍需进一步研究。文章采用模拟软件ANSYS对微尺寸的SiC薄膜在不同条件下的力学性能进行了理论分析。研究了SiC薄膜的面积和厚度对刚度的影响,结果表明,其刚度与薄膜面积成反比,与薄膜厚度的三次方成正比。其次,研究了材料中缺陷的尺寸及其位置对SiC薄膜力学性能的影响,模拟结果表明,缺陷的位置越接近薄膜中心,对刚度的影响越大;缺陷的尺寸越大,密度越高,薄膜的刚度越小。根据实验测得高温下杨氏模量数据,模拟计算发现SiC薄膜的刚度在290~2 500K范围内,随温度升高呈准线性下降趋势。
At present, the mechanical properties of SiC films under extremely harsh environment is not yet clear, and the relevant mechanical parameters still need further study. In this paper, the simulation software ANSYS is used to analyze the mechanical properties of micro-sized SiC films under different conditions. The effect of SiC film area and thickness on the stiffness was studied. The results show that the stiffness is inversely proportional to the film area and proportional to the cube of the film thickness. Secondly, the influence of the size and position of defects on the mechanical properties of SiC films was studied. The simulation results show that the closer to the film center, the greater the influence on the stiffness. The larger the size and the higher the density, The less rigid. According to the experimental data of Young’s modulus at high temperature, the calculated SiC film stiffness is in the range of 290-2 500K, and shows a decreasing trend with the increase of temperature.