为研究脉冲激光刻蚀聚酰亚胺基底镀金属薄膜过程,采用有限元软件COMSOL Multiphysics构建高斯脉冲激光辐照复合材料的2维非稳态物理模型,通过求解热传导方程计算不同功率激光辐照金属薄膜的温度场分布,讨论不同激光参数对刻蚀进程的影响。模拟结果表明:刻蚀深度主要受激光功率密度的影响,且随着金属薄膜厚度的增加,激光刻蚀深度先减小后保持不变。在刻蚀过程中,为了更好地保护基底,应选择大功率短脉宽的激光参数;由于铜薄膜比铝薄膜更难刻蚀,在铜薄膜的刻蚀过程中应选择较大功率密度的激光。结果有助于理解激光刻蚀过程,对实际刻蚀过程有一定的指导意义。 In order to study the process of pulsed laser etching polyimide substrate metallized film, a 2-dimensional unsteady physical model of Gaussian pulsed laser irradiated composite material was constructed by the finite element software COMSOL Multiphysics. The heat conduction equations were used to calculate the thermal conductivity of irradiated metal The temperature distribution of the film, discuss the influence of different laser parameters on the etching process. The simulation results show that the etching depth is mainly affected by the laser power density, and with the increase of the thickness of the metal film, the laser etching depth first decreases and remains unchanged. In the etching process, in order to better protect the substrate, you should choose the laser parameters of high power and short pulse width; the copper film is more difficult to etch than the aluminum film, copper film etching process should choose a higher power density laser. The results help to understand the laser etching process, the actual etching process has some guiding significance.