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本文主要叙述国内外近年来有关常温、高温和低温用的新型热敏材料和热敏电阻的研制动态。重点阐述高速响应SiC薄膜热敏材料、尖晶石氧化物半导体厚膜热敏材料、碳化物多晶烧结体高温热敏材料、锗薄膜低温热敏材料的主要性能和制备工艺,以及热敏电阻的制法和应用前景。
This article describes the domestic and foreign recent years, the temperature, high temperature and low temperature with the new thermal materials and thermistor research developments. This article focuses on the main performance and preparation process of high speed responsive SiC thin film thermal materials, spinel oxide semiconductor thick film thermal materials, carbide polycrystalline sintered body high temperature thermal materials, germanium thin film low temperature thermal materials and thermistors The system of law and application prospects.