不久前,本人看了贵刊98年第3期上《印刷电路板腐蚀新法》一文。经实践后,发现其不失为一种好方法,但也存在一些不足之处。通过摸索和查找有关资料后,撰写此文,对新法作几点补充。一、从理论上说,任何导电溶液均可作为“电镀液”,但也有其效果优劣之分。本人认为最好采用硫酸铜(胆矾、蓝矾)溶液,若采用比铜活泼的金属盐溶液, Not long ago, I read your magazine on the 3rd issue of 98 “printed circuit board corrosion new law,” a text. After practice, it was found to be a good way, but there are some shortcomings. After groping and finding relevant information, I wrote this article to make some supplements to the new law. First, in theory, any conductive solution can be used as a “plating solution”, but also has its advantages and disadvantages of the points. I think the best use of copper sulfate (cholera, blue alum) solution, if the use of lively than the metal salt solution,