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对纳米银焊膏的低温烧结过程进行了研究。首先采用热重分析(TG-DSC)研究了纳米银焊膏有机物挥发的物理机制,确定合理的试验参数。运用扫描电镜(SEM)观察不同条件下纳米银焊膏的微观结构。结合MATLAB软件对SEM图片进行处理,定量分析孔隙率的变化。采用ASTM E112-96标准中的线性插值法对纳米银焊膏的平均颗粒尺寸进行统计。结果显示,升高温度、加快升温速率以及延长保温时间可以有效提高纳米银焊膏的致密化程度;过高的温度和过长的保温时间会导致烧结银颗粒粗化。
The nano-silver solder paste low-temperature sintering process was studied. First, the thermogravimetric analysis (TG-DSC) was used to study the physical mechanism of nano-silver solder paste organic volatilization and determine the reasonable test parameters. Scanning electron microscopy (SEM) was used to observe the microstructure of nanosilver paste under different conditions. Combined with MATLAB software to deal with SEM images, quantitative analysis of porosity changes. The average particle size of nano-silver solder paste was calculated by linear interpolation method in ASTM E112-96 standard. The results show that increasing the temperature, accelerating the heating rate and prolonging the holding time can effectively improve the densification degree of the nano-silver solder paste. Excessively high temperature and too long holding time lead to the coarsening of the sintered silver particles.