利用硅对CO_2激光吸收是自由载流子吸收的特点,将有微缺陷的硅片按器件图形扩硼以后,再用CO_2激光进行短时间退火,能够只把器件有源区里面的微缺陷消除掉。 实验结果表明,经CO_2激光退火以后,报废器件的性能可以修复,有微缺陷的硅片可以用来做器件,而且效果更好。CO_2激光退火的选择是在退火过程中自动完成的,不需要借助于任 The use of silicon on the CO_2 laser absorption is characterized by the free carrier absorption, the micro-defect silicon devices according to the device after the boron expansion, and then CO_2 laser annealing for a short time, the device can be active only within the micro-defects to eliminate Off The experimental results show that after the CO_2 laser annealing, the performance of scrapped devices can be repaired, and the micro-defect silicon can be used as the device, and the effect is better. The choice of CO2 laser annealing is done automatically during the annealing process, without the need for any help