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本文试就包装薄膜在经受冲击、穿刺过程中的应力分布进行了力学分析,主要讨论了园球型压头模型。简单评述了几种ASTM关于薄膜的冲击穿刺试验方法,讨论了薄膜的耐冲击穿刺的几个问题。
This paper attempts to analyze the stress distribution of the packaging film under impact and puncture, and mainly discusses the ball-type head model. Briefly reviewed several ASTM test methods for impact puncture of films, and discussed several issues of impact puncture of films.