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微胶接技术非常适用于微机电系统产品的自动化装配过程.微胶接装配质量容易受到2个因素的影响,即胶滴体积的不稳定和胶滴的扩散.为了解决该问题,对微胶接装配中的胶接区表面结构进行了研究.提出2种表面结构:基本的凹槽结构和胶滴自居中结构,并进行实验.实验结果表明,凹槽结构对胶滴体积具有一定的“容错性”,可以有效克服胶滴体积的不稳定和胶滴的扩散对微胶接装配质量的影响;自居中结构使得胶滴在凹槽内具有“自居中”的特性,可以减轻微装配系统定位误差对装配质量的影响.这2种表面结构可用于通用微机电系统产品的装配中,以提高微胶接装配的质量.
Micro-adhesive technology is very suitable for the automated assembly process of micro-electro-mechanical system products.Micro-adhesive assembly quality is easily affected by two factors, namely the instability of the droplet volume and the spread of the droplet.In order to solve this problem, Then, the surface structure of the adhesive area in the assembly was studied, and two kinds of surface structures were proposed: the basic groove structure and the self-centering structure of the glue drop, and the experiment was carried out.The experimental results show that the groove structure has a certain “ Fault tolerance ”can effectively overcome the instability of the droplet volume and the spread of the droplet on the quality of the micro-adhesive assembly; the self-centering structure enables the droplet to have a“ self-centering ”characteristic in the groove, which can reduce the micro-assembly system Positioning error on the assembly quality of these two kinds of surface structure can be used for general assembly of MEMS products to improve the quality of micro-mount assembly.