业余电子爱好者,腐蚀铜箔制作印制电路板时经常采用的方法有两种,即“三氯化铁腐蚀液”和“过氧化氢(H_2O_2,俗称双氧水)、盐酸(HCl)、水(H_2O)按1:2:3比例配制的腐蚀液”(简称“过氧化氢”腐蚀液),并在实践中发现,后一种方法比前一种方法腐蚀铜板快得多,是值得推广应用的好方法。为了说明其因,笔者将其化学腐蚀过程剖析如下: Amateur electronic enthusiasts, the production of printed circuit board corrosion of copper foil are often used in two ways, namely “ferric chloride corrosion solution” and “hydrogen peroxide (H_2O_2, commonly known as hydrogen peroxide), hydrochloric acid (HCl) , Water (H_2O) according to the ratio of 1: 2: 3 ”(“ ”hydrogen peroxide " corrosion solution), and in practice found that the latter method is faster than the former method of corrosion of copper More, is a good way to promote the use of. In order to explain its causes, the author of its chemical corrosion process is as follows: