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高开孔率、大厚度金属精细网板的制造是网板业界的技术难题。分析了现有的精细金属网板制造工艺的优缺点,并提出采用基于SU-8光刻胶的UV-LIGA技术来制备高开孔率大厚度精细金属网板的工艺思路。优选了关键工艺环节的操作参数,表征了试样的形貌特点,检测并分析了试样的相关性能。结果显示,采用优化的工艺条件(前烘65 ℃/20min,95 ℃/20 min;适量曝光剂量;后烘65 ℃/10 min,95 ℃/15min;匀胶后静置、随炉冷却;超声辅助显影等)所制备的六边形镍网(边200μm) ,不仅开孔率高(88%) ,厚度大((120±3)μm) ,且具有尺寸精度高(形位误差±2μm)、孔形一致性好(筋宽偏差<3μm)、孔壁平滑等特点。结果表明,UV-LIGA技术是一种制备高通孔率、大厚度精细金属网的有效工艺手段。
High open-hole ratio, the manufacture of large thick metal fine mesh board is the technical problem of the screen board industry. The advantages and disadvantages of the manufacturing process of the existing fine metal mesh are analyzed. The technical idea of using the UV-LIGA technology based on SU-8 photoresist to prepare the high-open-rate large-thickness fine metal mesh is proposed. The operating parameters of the key process are optimized, the morphology of the sample is characterized, and the relative performance of the sample is tested and analyzed. The results showed that the optimum conditions were as follows: pre-baking at 65 ℃ / 20min, 95 ℃ / 20min; proper exposure dose; post-baking at 65 ℃ / 10min, 95 ℃ / 15min; Hexagonal nickel mesh (200 μm in side size) prepared by using a hexagonal nickel mesh (having an aperture ratio of 88%) and a large thickness of (120 ± 3 μm) and having a high dimensional accuracy (a shape error of ± 2 μm) , Good hole consistency (deviation of rib width <3μm), smooth hole wall and so on. The results show that UV-LIGA technology is an effective process for preparing high-porosity, large-thickness fine metal mesh.