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此篇论文将介绍一个用于半导体光罩上图样设计以及可用于实际生产的光刻反向计算技术(ILT)。在论文中将讨论有关ILT的最新发展,包括在超成像极限协助图样(SRAF)的生成,可增加制程宽容度的ILT,以及如何生成满足光罩生产标准的图样等方面。从内部的研究结果和客户的使用结果可以看出,ILT已经不再只是一种用于研究的工具,而是已经可以用于先进半导体制程的大规模生产。在对各个环节优化之后,ILT可以增加制程的宽容度,同时将光罩的成本控制在可以接受的水平。
This essay will introduce a Lithography Reverse Computation Technology (ILT) for patterning on semiconductor masks and for practical production. Recent developments in ILT will be discussed in the paper, including the creation of super-imaging limited assist patterns (SRAFs), increased process latitude ILT, and how to produce patterns that meet mask production standards. It can be seen from the internal research results and the customer’s usage results that the ILT is no longer just a tool for research but can already be used for mass production of advanced semiconductor processes. After optimizing for all aspects, ILT can increase process tolerance while keeping the cost of the mask at an acceptable level.