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设备的散热问题始终是开发者要面临的难题。设想一下军用设备所面对的挑战:空间小、挤满了电子器件、以及在极限温度下必须正常运行的大功率车辆等。一项美国国防部(DOD)“多学科大学研究创议”(MURI)赞助的新项目试图解决芯片级的散热问题。
Equipment cooling problem has always been developers face the problem. Imagine the challenges facing military equipment: small space, packed with electronics, and high-power vehicles that must operate normally at extreme temperatures. A new project sponsored by the Department of Defense (DOD) and MURI has attempted to address chip-level cooling issues.