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介绍了深高宽比微结构在干法刻蚀过程中遇到的刻蚀滞后、刻蚀中止、侧壁弯曲和开槽效应等与传统器件刻蚀不同的现象,讨论了制作高深宽比结构所需的关键技术和检测手段。
The phenomena of etching hysteresis, ablation stop, side wall bending and slotting effect encountered in the dry etching process of the deep aspect ratio microstructures are introduced. Different from the traditional etching process, the high aspect ratio structure The necessary key technologies and testing methods.