半导体器件的管芯测试,即中测,是半导体生产的重要工序之一.通常采用探针扎在被测管芯的对应压焊点上,用以接通测试回路的对应端.当探针数目超过二、三十根时(例如大规模集成电路),传统的手动探针就很难对准,加之电信号的相互干扰,分布电容的增加,以及因接触不良而加强了的感应电压,往往使测试失误.因此,采用探针卡片(probe-rcard)测试,是半导体器件中测的重要技术改革. Die testing of semiconductor devices, ie, mid-measurement, is one of the important processes in semiconductor manufacturing, and probes are typically attached to the corresponding pads of the die under test to turn on the corresponding terminals of the test circuit. When the number is more than two or thirty (for example, a large-scale integrated circuit), the conventional manual probes are hard to be aligned. In addition to the mutual interference of electrical signals, the increase of distributed capacitance, and the induced voltage intensified by poor contact, Often making the test mistakes.Therefore, the use of probe-card (probe-rcard) test, is an important technological innovation in semiconductor devices.