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红外焦平面阵列中盲元的存在降低了红外图像的质量以及红外系统的性能。在系统应用中可以使用算法对盲元进行补偿,但对于焦平面阵列研制而言,盲元的状态却是决定其是否合格的重要因素之一。通过对红外焦平面阵列工艺过程的分析,确定了盲元的4种主要类型、产生的工艺过程和形成的原因。研究了每种类型盲元的特征和表现形式,推导出像元输出电压与盲元种类之间的关系表达式。据此提出了一种简捷的盲元类型判别方法:通过观测盲元的输出波形,即可判定它们的类型。根据盲元类型,可定位于相应的工艺过程,在实现工艺和质量监控的同时,有助于降低红外焦平面阵列的盲元数量、提高制备技术和成品率,保障批产的稳定性。
The presence of blind elements in an infrared focal plane array reduces the quality of the infrared image and the performance of the infrared system. The algorithm can be used to compensate for blind elements in system applications. However, for the development of focal plane arrays, the status of blind elements is one of the important factors that determine whether the blind elements are qualified or not. Through the analysis of the process of the infrared focal plane array, the four main types of blind elements, the process and the formation of the blind element are determined. The characteristics and manifestations of each type of blind element are studied, and the expression of the relationship between the pixel output voltage and the type of blind element is deduced. Based on this, a simple method of discriminating blind type is proposed. By observing the output waveform of blind type, we can determine their type. According to the type of blind element, it can be located in the corresponding process, which can help to reduce the number of blind elements in the infrared focal plane array, improve the preparation technology and yield, and ensure the stability of lot production while realizing the process and quality control.