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采用10 A电流对Cu/Sn58Bi/Cu对接接头进行加载,研究了不同通电时间下电迁移对Sn58Bi无铅钎料显微组织及力学性能的影响。结果表明:钎料显微组织在“电子风”力作用下发生明显的粗化,在阳极界面附近出现大块的富Bi相,且富Bi相的平均尺寸不断增大。在通电时间为200 h时,钎料的抗拉强度降低到13.3 MPa,相比于未通电的试样,降低幅度达到了69.2%,同时延伸长度从132μm降到48μm,钎焊接头的力学性能发生了明显的恶化。
The effects of electromigration on the microstructure and mechanical properties of Sn58Bi lead-free solder were studied by using 10 A current to load Cu / Sn58Bi / Cu butt joints. The results show that the microstructure of brazing filler metal is obviously roughened under the action of “electron wind” force, large bulk Bi phase appears near the anode interface, and the average size of Bi-rich phase increases. At 200 h, the tensile strength of the brazing filler metal was reduced to 13.3 MPa, compared with that of the non-energized sample, the reduction range reached 69.2% and the elongation was reduced from 132 μm to 48 μm. The mechanical properties of brazed joints A significant deterioration occurred.