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Applications of HIP technique on W-Cu composites are studied and developed.The Cu-infiltrated W composites without nickel can be densified easily by HIP processing at the temperature below the melting point of copper.The relative density of W-Cu composites increases from 96%— 97%to nearly full dense for the materials in which copper contents are more than 30 percent in weight and improves to near 99 percent for W-Cu20 composites.The properties of W-Cu materials,such as strength,hardness and electrical conductivity,and the homogeneity of properties are improved significantly.The diffusion bonding of W-Cu to W-Cu or Cu by HIP processing is also studied.The bonding strength is in correspondence with that of matrix.It is possible to produce large dimension W-Cu workpieces and(W-Cu)-Cu complex layer materials in commercial scale.
Applications of HIP technique on W-Cu composites are studied and developed. The Cu-infiltrated W composites without nickel can be densified easily by HIP processing at the temperature below the melting point of copper. The relative density of W-Cu composites increases from 96 % - 97% to nearly full dense for the materials in which copper contents are more than 30 percent in weight and improves to near 99 percent for W-Cu20 composites.The properties of W-Cu materials, such as strength, hardness and electrical conductivity , and the homogeneity of properties are improved significantly. The diffusion bonding of W-Cu to W-Cu or Cu by HIP processing is also studied. The bonding strength is in correspondence with that of matrix. It is possible to produce large dimension W- Cu workpieces and (W-Cu) -Cu complex layer materials in commercial scale.