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采用微波辅助酸热处理法对SPI(大豆分离蛋白)进行改性,并以高活性的改性PAE(聚酰胺)作为交联剂,再与LSP(大豆蛋白液化产物)进行混合,制备出耐水性良好的胶合板用TSP(改性SPI)胶粘剂。着重探究了不同处理温度对SPI分子结构和胶粘剂性能的影响,并通过压制的胶合板来评价不同处理方式对SPI基胶粘剂胶接强度的影响。研究结果表明:当m(TSP)∶m(LSP)∶m(PAE)=5∶5∶3、w(PAE固含量)=25%时,胶粘剂的工艺使用性能以及胶接强度相对最佳;当微波功率为400 W、酸热处理温度为120℃时,处理后SPI的不溶率为82%,并且其不溶物团聚成网状结构,由该胶粘剂压制的胶合板达到国家标准中Ⅰ类板的指标要求。
SPI (soybean protein isolate) was modified by microwave-assisted acid heat treatment and mixed with LSP (soybean protein liquefaction product) with highly active modified PAE (polyamide) as crosslinking agent to prepare water-resistant Good plywood with TSP (modified SPI) adhesive. The effects of different treatment temperatures on SPI molecular structure and adhesive properties were investigated emphatically. The effects of different treatment methods on the bonding strength of SPI-based adhesives were evaluated by pressing plywood. The results show that the process performance and bonding strength of adhesive are the best when m (TSP): m (LSP): m (PAE) = 5: 5: 3 and w (PAE solid content) When the microwave power is 400 W and the acid heat treatment temperature is 120 ℃, the insoluble rate of SPI after treatment is 82%, and the insoluble matter agglomerates into a network structure. The plywood pressed by the adhesive achieves the index of Class I board in the national standard Claim.