半导体产业正在面临一项挑战,即每两年微缩芯片特征尺寸的周期已然结束,我们正在跨入一个情势高度不明的阶段。业界目前面临的几项关键挑战都显示,芯片微缩的路程愈来愈艰困了。1.晶圆代工厂量产32/28 nm晶圆的周期延长到了三年左右。2009年,45/ The semiconductor industry is facing a challenge that the cycle of miniature chip feature sizes is completed every two years and that we are entering a phase of high uncertainty. Several key challenges the industry is facing now show that the miniaturization of chips is getting more and more difficult. 1. Wafer foundry production cycle 32/28 nm wafer extended to about three years. In 2009, 45 /