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外界能量通过贯通线进入开孔屏蔽体,与PCB上MSL耦合而生成感应电流(Current),加剧了对敏感器件的耦合伤害。故建立含贯通线及PCB板开孔屏蔽腔模型,进行多角度耦合特性计算。在建模有效性验证后,利用有限元法探讨平面波激励下PCB不同模型、MSL上不同端接电阻、贯通线半径、贯通线与腔体壁相接及多贯通线等参数变化对Current的影响规律。结果表明:双介质模型的使用更接近实际PCB结构对场的影响;两端接电阻取值相差不大条件下,可不考虑与MSL的阻抗匹配,取值也可不相等;Current数值随贯通线半径的增加而增加;贯通线与腔体壁不同表面相接对应Current幅值要远高于非接触的情况,并会激出新的谐振点。多根贯通线及线间距改变时Current幅值都要高于单线的情况,尤以第一谐振之前更为明显,多线存在不会影响谐振点出现位置。
The external energy enters the hole shielding body through the through-hole and is coupled with the MSL on the PCB to generate an inductive current (Current), which aggravates the coupling damage to the sensitive device. Therefore, the establishment of through-hole and PCB perforated shield cavity model, multi-angle coupling characteristics of the calculation. After validation of the model validation, the influence of the different models of PCB under PCB excitation, the different termination resistances on MSL, the radii of through-wires, the connection of through-wires to cavity walls and the multi-through lines, law. The results show that the use of dual-medium model is closer to the effect of actual PCB structure on the field. Under the condition of little difference between the two ends, the impedance matching of MSL may not be considered and the values may not be the same. Current value varies with the penetration radius Of the increase and increase; through the line and the cavity wall surface is connected to different Current amplitude is much higher than the non-contact situation, and will stimulate the new resonance point. The current amplitude of multi-through lines and line spacing should be higher than that of single lines, especially before the first resonance. Multi-line existence will not affect the position of resonance point.