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高速PCB板的设计首先要解决好信号完整性问题,本文依据信号在ATE测试机台走向针对通孔、传输线和涂层等几个方面对高速PCB设计做几点探讨。
High-speed PCB board design must first solve the problem of signal integrity, this article based on the signal in the ATE test machine for through-hole, transmission line and coating on several aspects of high-speed PCB design to do some discussion.