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随着光刻特征尺寸的不断减小,尤其是随着分辨力增强技术的使用,像质参数的原位检测已成为先进的投影光刻机中不可或缺的功能。然而现有的每种技术均只能检测有限的几种像质参数。提出了一种新的基于像传感器的光刻机多成像质量参数原位检测(MIQM)技术。该技术通过对原有的测量模型进行修正和扩展,从而在精确测量低阶成像质量参数的同时能高精度地测量高阶成像质量参数。此外,该技术是基于空间像测量的像质参数原位检测技术,从而具有速度快、稳定性好等优点。通过该技术的低阶像质参数测量精度与原有技术相近,而高阶像质参数测量重复精度优于1 nm。实验结果表明该技术能一次完成步进扫描投影光刻机的多个像质参数的精确测量,从而简化了光刻机像质检测过程,大量节约了测量时间,有效避免了像质参数之间的互相影响。
As lithographic feature sizes continue to decrease, especially with the use of resolution enhancement techniques, in situ inspection of image quality parameters has become an integral part of advanced projection lithography. However, each of the existing technologies can only detect a limited number of image quality parameters. A new multi-imaging quality parameter in situ detection (MIQM) technology based on image sensor is proposed. The technology corrects and expands the original measurement model to accurately measure high-order imaging quality parameters while accurately measuring low-level imaging quality parameters. In addition, the technique is based on in-situ detection of image quality parameters measured in space and thus has the advantages of fast speed and good stability. The accuracy of the low-level image quality parameters measured by this technique is similar to that of the prior art, while the high-order image quality parameters have better repeatability than 1 nm. The experimental results show that this technique can accurately measure multiple image quality parameters of the step-and-scan projection lithography machine at one time, thus simplifying the image quality detection process of the lithography machine, saving a great deal of measurement time and effectively avoiding the difference between the image quality parameters The mutual influence.