采用有限元分析方法对制冷封装CCD工作在低温时光窗外表面温度过低产生露珠的现象进行了研究,分析了光窗与芯片表面(冷端)不同距离时光窗的最低温度以及内部填充不同气体时光窗的最低温度。通过有限元分析得到了光窗不产生露珠时的最优封装设计结构。 Finite element analysis was used to study the phenomenon that dewdrop was generated when the temperature of the outer surface of the window was too low when the CCD was operating at low temperature. The minimum temperature of the window at different distance between the window and the surface of the chip (cold end) was analyzed. The minimum temperature of the window. Through the finite element analysis, the optimal package design structure of the window without dew is obtained.