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由多个芯片直接安装在电路基片上的多芯片模块（ＭＣＭ）可望缩短布线长度，提高运算速度和组装密度，从而应用于宽带综合服务数字网络（Ｂ—ＩＳＤＮ）中。然而，随着半导体器件储存成度和组装密度的提高和模块外形尺寸的缩小，功耗密度随之增加。这使得热设计显得更加重要。本文介始了在高速高密度多芯片模块的热设计中应用有限元分析法模型的边界条件。着重研究了热路、散热片以及提高热传递模拟精度的方示。
Multi-chip modules (MCMs) with multiple chips mounted directly on the circuit substrate are expected to be used in Broadband Integrated Services Digital Network (B-ISDN) due to reduced wiring length, increased processing speed and assembly density. However, with the improvement of the storage degree and the assembly density of the semiconductor device and the reduction of the size of the module, the power density increases accordingly. This makes thermal design even more important. This article starts with the boundary conditions for applying the FEA model to the thermal design of high-speed, high-density multi-chip modules. Emphasis is placed on the study of hot runners, heat sinks, and square displays that improve simulation of heat transfer.