PbSn等合金熔融后,经水雾化法或气雾化法制成粉末,配以助焊剂、溶剂等材料组成焊接浆料(Solder Paste),该浆料在电子元器件再流焊(reflow soldering)工艺中的应用越来越广泛。本文介绍了核八所研制生产的PbSn等合金粉末所配制的焊接浆料及其在流焊工艺中的实际应用。 PbSn and other alloys are melted and then made into a powder by a water atomization method or an aerosolization method, and a soldering paste (Solder Paste) is prepared by using materials such as a flux and a solvent, and the slurry is reflow soldered in an electronic component, The application of technology is more and more widely. This paper introduces the welding paste prepared by the alloy powder such as PbSn developed and produced by Nuclear Eight and its practical application in the flow soldering process.