A special thermal modeling tool, CrysVUn, which was developed by Crystal Growth Laboratory (CGL) of Fraunhofer Institute of Integrated Systems and Devices Technology in Erlangen of Germany, was used for numerical analysis of growth Interface situation. The heat transportation, argon flow and melt convection have been considered. Cauchys first and second laws of motion have been the governing partial equations for stress calculation. The measurement results and simulation results were compared and the interface shape and thermal stress distribution during 300 mm Czochralski (CZ) silicon crystal growth with different growth rates were predicted.