论文部分内容阅读
运用变角Ｘ射线光电子谱和原子力显微镜技术对沉积于Ｓｉ３Ｎ４衬底表面上的纳米级Ａｕ薄膜的电迁移特性进行了实验研究。结果表明：在电场作用下，薄膜表面的微观结构发生了变化，Ａｕ的晶粒趋向细化，膜层趋于均匀，表面粗糙度降低；电迁移过程中 Ａｕ与衬底 Ｓｉ３Ｎ４发生了界面化学反应，生成了 Ａｕ的硅化物ＡｕＳｉｘ。
The electromigration characteristics of nanoscale Au thin films deposited on the surface of Si3N4 substrate were investigated by using variable angle X-ray photoelectron spectroscopy and atomic force microscopy. The results show that under the action of electric field, the microstructure of the surface of the film changes. The grain size of Au tends to be finer, the film becomes more uniform and the surface roughness decreases. The interfacial chemical reaction between Au and the substrate Si3N4 occurs during electromigration , A Au silicide AuSix was generated.