六、工艺管理 工艺管理内容应包括对各检验点进行测量和目检,并用此检测结果来修改工艺以达到预期目的。在集成电路工艺管理中,基本的电气测量包括伏安特性(结的正反向)、C-V特性、电阻以及管晶体的特性测量等。目检包括观察明显的沾污,表面完整性、氧化层的钻蚀、尺寸误差和套准精度等。有时也测量(全部或大部分)动态特性(如上升和下降时间等)。在工艺管理中还必须进行寿命和环境试验、热老化(加或不加偏压)和阶梯应力试验。另外解剖分析和物理测试也是不可少的数据。 良好的工艺管理不只是提高成品率,更重 Six, process management Process management should include the measurement of the inspection points and visual inspection, and use the test results to modify the process in order to achieve the desired purpose. In integrated circuit process management, basic electrical measurements include volt-ampere characteristics (forward and reverse junction), C-V characteristics, resistance, and tube crystal properties. Visual inspection includes the observation of significant contamination, surface integrity, erosion of oxide layers, dimensional errors and registration accuracy. Sometimes (all or most) of the dynamic characteristics (such as rise and fall times, etc.) are also measured. Lifetime and environmental testing, thermal aging (with or without bias) and step stress testing must also be performed in process management. In addition, anatomical analysis and physical testing are also essential data. Good process management does more than just improve yield