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通过对几种典型无铅钎料的电化学性能的研究，提出了无铅 钎料研究开发及应用时 应考虑因其超电势变化带来的影响问题。试验证明，含铋元素无铅钎料较传统的锡铅钎料超电势低，含铟无素无铅钎料则较锡铅钎料有较高的超电势，并证明这是由 于合金中形成了 Ｉｎ Ｓｎ４ 化合物的缘故，从 而认为含铋无铅钎料应谨慎地使用于电器元件的焊接生产中，而含铟无铅钎料 则较锡铅钎料具有更高 的电化学安全性，在电器元件的焊接生产中具有良好的应用前景。
Based on the study of the electrochemical properties of several typical lead-free solders, it is proposed that the influence of overpotential changes should be considered in the research and development and application of lead-free solder. Experiments show that the bismuth-based lead-free solder is lower in overpotential than the conventional tin-lead solder, and the indium-free lead-free solder has a higher overpotential than the tin-lead solder and proves that this is due to the formation of In Sn4 compound sake, so that the bismuth-containing lead-free solder should be used with caution in the production of electrical components of the welding, and lead-free solder with indium is tin-lead solder has higher electrochemical safety, in the Electrical components of the welding production has a good prospect.