一、动态简介“无损检测”这一基本概念,从广义上来讲,就是在不破坏工件或原材料工作状态情况下测定其有效技术参数,以便对某工件或某材料的外部或内部的缺陷作出正确的判断。如在正常的生产和试验中所进行的测温测压,流量流速,电子管和晶体管的气密性检漏,以及电镀镀层的测厚和对印刷电路焊点的检测等,也都属于无损检测范围。 First, the dynamic introduction “Non-destructive testing,” the basic concept, in a broad sense, is without deteriorating the working conditions of the workpiece or raw materials to determine the effective technical parameters, in order to a workpiece or a material external or internal defects to make the right Judgment. As in the normal production and testing carried out in the temperature and pressure measurement, flow rate, vacuum tube and transistor leak detection, and plating thickness of the test and printed circuit board solder joints are also non-destructive testing range.