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针对TSOP封装在塑封工艺中脱模时可能发生的芯片碎裂,利用有限元法模拟封装脱模过程阐明了芯片碎裂失效的机制。研究表明,模具内表面有机物形成的局部沾污可能阻碍芯片的顺利脱模,导致硅片内产生较大的局部应力并碎裂失效。通过模拟在不同的沾污面积、形状和位置下的封装脱模,确认了最可能导致失效的条件。芯片碎裂失效可以通过使用高弹性模量的塑封料或减小硅片尺寸得以改善。
Aiming at the chip fragmentation that TSOP package may occur during the process of mold release, the mechanism of chip fragmentation failure is illustrated by simulating the process of mold release by finite element method. Studies have shown that local contamination of organic materials on the inner surface of the mold may hinder the smooth release of the chip, resulting in greater local stress in the silicon wafer and failure of the chip. By simulating the release of the package under different contaminant areas, shapes and locations, conditions most likely to cause failure were identified. Chip fragmentation failure can be improved by using a high elastic modulus molding compound or reducing the size of the wafer.