随着半导体集成电路封装技术的迅速发展,国内扁平管壳和双列直插式管壳已先后试制成功并逐步采用。这些管壳本身结构虽属气密性的,但由于封帽问题未彻底解决,封装的气密性最终仍难得到保证。目前扁平封装最终达到气密封接的主要途径,一种是采用低温合金焊料,另一种是电阻熔焊技术。比较这两种封接方法其优缺点如下: With the rapid development of semiconductor integrated circuit packaging technology, domestic flat tube and dual in-line tube shell has been successfully trial and gradually adopted. Although these tube shell itself is airtight structure, but due to the cap problem is not completely solved, the packaging of the air tightness is still difficult to be ultimately guaranteed. At present, the flat package finally reaches the main airtight seal, one is the use of low-temperature alloy solder, the other is resistance welding technology. The advantages and disadvantages of comparing these two sealing methods are as follows: