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在电子封装中 ,焊点失效将导致器件乃至整个系统失效 ,焊点失效的起因是焊点中热循环引起的裂纹及其扩展。从焊点的微观组织及其变化、焊点失效分析、焊点可靠性预测等方面介绍了对电子封装焊点及其可靠性研究的状况。
In the electronic package, the solder joint failure will lead to failure of the device and the entire system. The cause of the solder joint failure is the crack caused by thermal cycling in the solder joint and its expansion. This paper introduces the research status of electronic package solder joints and their reliability from the aspects of microstructure and variation of solder joints, failure analysis of solder joints and prediction of solder joint reliability.