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为了满足工业生产中提出的结构轻量化要求,采用IPG光纤激光器对薄板T型接头进行了激光穿透焊试验,通过改变激光穿透焊工艺参数,研究不同热输入对焊接接头显微组织及接头尺寸变形量的影响,并对接头显微硬度进行了测试和分析。结果表明,随着热输入的增加,焊缝熔深增大,焊缝及热影响区晶粒尺寸增加,焊缝内马氏体的含量减少,焊缝及热影响区内显微硬度呈下降趋势;焊缝组织为马氏体和上贝氏体,粗晶区为贝氏体和少量马氏体,细晶区为粒状贝氏体和珠光体;焊缝及热影响区的显微硬度值均高于母材。
In order to meet the requirements of industrial structure, the IPL fiber laser was used to test the penetration of thin-plate T-joints by changing the parameters of laser penetration welding. The effects of different heat input on the microstructure and joints of welded joints Dimensional deformation and the microhardness of joints were tested and analyzed. The results show that as the heat input increases, the weld penetration increases, the grain size increases in the weld and heat affected zone, the content of martensite in the weld decreases, and the microhardness in the weld and heat affected zone decreases The weld microstructure is martensite and upper bainite, the coarse grain area is bainite and a small amount of martensite, the fine grain area is granular bainite and pearlite, and the microhardness of weld and heat affected zone Value is higher than the base metal.