美国国家半导体公司正在开发用于无线领域的多层陶瓷模块。这些多层陶瓷模块是由一种被称为LTCC(low-temperature cofired ceramic)的工艺制造的,它可以完整地将一组无线电组件封装在单一模块中,该模块能被直接安装在印制电路板上。这一研究成果解决了难于将分立元件集成在硅片上的困难,使无线产品具有更高的集成度。 LTCC工艺可使种类繁多的元件集成在一单基片 National Semiconductor is developing multi-layer ceramic modules for the wireless field. These multi-layer ceramic modules are manufactured by a process known as LTCC (low-temperature cofired ceramic) that completely encapsulates a set of radio components in a single module that can be mounted directly on a printed circuit On the board. This research results have solved the difficulty of integrating discrete components on the silicon, making wireless products more integrated. The LTCC process enables a wide variety of components to be integrated in a single substrate