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集成电路的高复杂度和装配的高密度,使得只用单一的IEEE1149标准来进行电路的自测试已经不能满足需要,在研究IEEE1149.1、.4和.5三种标准的差异性和组合应用准则的基础上,设计了融合三种标准进行混合信号多级扫描的方法。并通过实验平台的搭建与测试,验证了该方法的可行性,为数模混合量的检测以及多模块间的组合测试提供了实用参考。
The high complexity of the integrated circuit and the high density of the assembly make the self-test of the circuit using only a single IEEE1149 standard can not meet the needs. In studying the differences and combination applications of the three standards of IEEE1149.1, .4 and .5 On the basis of the criterion, a method of multi-level scanning of mixed signals is designed by combining three standards. The feasibility of this method is verified through the construction and testing of the experimental platform, which provides a practical reference for the testing of the mixed quantity of the digital and analog modules and the combined testing of multiple modules.