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Y2002-63318-55 0327888功率电子学中的倒装芯片柔性电路封装=Flip-Chipflex-circuit packaging for power electronics[会,英]/Xi-
Y2002-63318-55 0327888 Flip Chip Flexible Circuit in Power Electronics Packaging = Flip-Chipflex-circuit packaging for power electronics [English] / Xi-