论文部分内容阅读
本文研究了如何运用CO_2激光清洗控制电缆多芯插头霉菌,分析了清洗机理,设计了实验装置,对影响激光清洗效果和实际应用的关键因素进行了重点讨论。分析和实验结果表明,在激光参数选择合适的情况下可实现对霉菌的完全清洗而不会对插头基体造成损伤,激光清洗技术能够安全有效地清除控制电缆多芯插头上生长的霉菌。激光清洗霉菌的机理有:一、激光产生的高温导致霉菌的瞬间汽化和燃烧;二、基体表面在激光辐照射下温度发生急剧变化而产生热膨胀变形导致的加速度及插头座芯孔狭小空间内空气急剧膨胀导致的内外气体之间的巨大压差,将霉菌从插头上除去。
This paper studies how to use CO_2 laser to clean the mold core of multi-core connector of control cable. The cleaning mechanism is analyzed and the experimental device is designed. The key factors affecting the laser cleaning effect and its practical application are discussed emphatically. The analysis and experimental results show that the mold can be completely cleaned without any damage to the plug base when the laser parameters are selected properly. The laser cleaning technology can safely and effectively remove the molds growing on the multi-core plug of the control cable. The mechanism of laser cleaning mold are as follows: First, the high temperature generated by the laser causes instantaneous vaporization and combustion of the mold; Second, the substrate surface in the laser irradiation temperature changes rapidly resulting in thermal expansion and deformation caused by the acceleration and plug seat core hole narrow space The sharp pressure differential between the inside and outside gases caused by the rapid expansion of the air removes the mold from the plug.