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Polyimide films have been widely used in various electronic devices that are especially called as ubiquitous tools.
Enhancement of Polyimide/Copper Film Adhesion by Dense Carbon Interlayer using Microwave Plasma CVD
【摘 要】
：
Polyimide films have been widely used in various electronic devices that are especially called as ubiquitous tools.
【机 构】
：
Department of Electrical Engineering and Computer Science, Nagoya University, Japan
【出 处】
：
2011年第三届微电子及等离子体技术国际会议
【发表日期】
：
2011年9期
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