【摘 要】
：
An atomistic modeling technique was used to theoretically and experimentally investigate the curing and thermal transition behavior of two epoxy resins with different chemical structures i.e.diaminodi
【机 构】
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State Key Laboratory of Organic-Inorganic Composites
【出 处】
：
2013 International Symposium on Integrated Molecular / Mater
论文部分内容阅读
An atomistic modeling technique was used to theoretically and experimentally investigate the curing and thermal transition behavior of two epoxy resins with different chemical structures i.e.diaminodiphenyl methane (DDM)/4,5-epoxyclyclohexyl-1,2-diglycidyl diformate (TDE85) and diamino diphenyl sulfone (DDS)/4,S-epoxyclyclohexyl-1,2-diglycidyl diformate (TDE85) to establish the structure-property relationships.The simulated results predict the slight modification in the diamine structure result in significant change in the cure and glass transition behavior of epoxy resin.As the bridging group of diamine is changed from methylene to sulphone, the reactivity ofdiamine toward epoxy increases and the glass transition temperature also increases from about 190 ℃ to about 230 ℃.These phenomena can be illustrated by the change of the reaction energy barrier, flexibility of chains and the cohesive energy density in the molecular simulation of curing process.The simulated values show good agreement with experimental data, and can be used to predict the related material characteristics for the different amine curing agent/epoxy systems.
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