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研究了石墨粒径及表面镀Si处理对石墨/Al复合材料热物理性能的影响。结果表明:在盐浴过程中石墨表面形成了SiC层,这不仅增强了石墨-Si/Al复合材料的界面结合力,而且抑制了Al4C3相的产生。随着石墨鳞片体积分数从50%增加到70%,复合材料X-Y方向的热导率从492 W/(m·K)增加到654 W/(m·K),而且体积分数为50%的镀Si石墨/Al复合材料抗弯强度达到了81 MPa,相比未镀覆的提高了53%,是理想的定向导热电子封装材料。随着石墨粒径从500μm减小到150μm,石墨-Si/Al复合材料X-Y面方向的热导率由654 W/(m·K)降低到445 W/(m·K),但Z方向的热导率和复合材料抗弯强度变化不明显。
The effects of graphite particle size and Si surface treatment on the thermophysical properties of graphite / Al composites were investigated. The results show that SiC layer is formed on the surface of graphite during salt bath, which not only enhances the interfacial bonding of graphite-Si / Al composites, but also inhibits the formation of Al4C3 phase. As the volume fraction of graphite flake increased from 50% to 70%, the thermal conductivity in XY direction increased from 492 W / (m · K) to 654 W / (m · K) and the volume fraction was 50% The flexural strength of Si graphite / Al composites reaches 81 MPa, which is 53% higher than that of uncoated ones. It is an ideal oriented thermal conductive electronic packaging material. The thermal conductivity of the graphite-Si / Al composite decreases from 654 W / (m · K) to 445 W / (m · K) as the graphite particle size decreases from 500μm to 150μm. However, Thermal conductivity and flexural strength of composites did not change significantly.