论文部分内容阅读
最近,日本通产省制订出进行超尖端加工技术的研究开发方针,以便进行10~9彼特级的下一代LSI(高密度集成电路)元件、宇航用新材料、核反应堆用高强度金属等材料的加工。目前的开发计划包括两方面内容:①研究能够对半导体超高集成化的微细加工技术和对陶瓷,高分子材料等进行高品位表面加工技术,即所谓“高能束加工技术”;②研究超高精密机械加工技术,以便为航空和宇航用的精密机械、高密度集成化半导体装置等加工出三维复杂形状和大型曲面形
Recently, the Ministry of International Trade and Industry (MITI) has formulated a research and development guideline for ultra-high-end processing technology in order to carry out 10 to 9-peter next generation LSI (high density integrated circuit) components, new aerospace materials, and high-strength metals for nuclear reactors Processing. The current development plan includes two aspects: ① research can be ultra-highly integrated semiconductor micro-processing technology and ceramics, high-molecular materials, such as high-grade surface processing technology, the so-called “high energy beam processing technology”; ② research ultra-high Precision Machining Technology to Process Three-Dimensional Complex Shape and Large Curved Surface for Precision Machinery, High-Density Integrated Semiconductor Device for Aerospace and Aerospace