论文部分内容阅读
水垢对铜板的导热能力有较大影响,文章利用扫描电镜和X衍射仪对结晶器水冷侧沉积物进行了分析研究,发现沉积物中的元素主要为氧、铜、铁、镍等。结晶器水冷侧表面的沉积物覆盖不均匀,厚度差别较大,沉积物与铜基体的结合非常紧密。为避免结晶器铜板表面出现沉积物,在生产中应严格按照软化水的水质要求,并添加性能满足要求的阻垢缓蚀剂。
The scale has a great influence on the thermal conductivity of the copper plate. The analysis of the sediments on the water-cooled side of the mold by SEM and XRD shows that the main elements in the sediment are oxygen, copper, iron, nickel and so on. The deposits on the water-cooled side of the mold are unevenly covered with large differences in thickness, and the deposit is very close to the copper matrix. In order to avoid the appearance of deposits on the surface of mold copper plate, the quality of demineralized water should be strictly followed in the production, and the scale and corrosion inhibitor with satisfactory performance should be added.