车用电子芯片市场分为车前市场和车后市场两大领域,进入障碍最高的是车前市场,半导体芯片厂无法直接与品牌车厂接触,通常要透过子系统模组供应商(Subsystem),或是日本称为汽车零部件供应商等业者进入品牌车厂的供应链。半导体厂下一个竞逐之地,美光(Micron)、旺宏、华邦、飞索(Spansion)等都开始布局抢进,美光和飞索推新世代存储器规格,试图抢车用电子主导权;旺宏 Automotive electronics chip market is divided into two major areas of the car market and the car market, the highest barrier to entry is the car market, the semiconductor chip plant can not directly contact with the brand car manufacturers, usually through the subsystem module supplier (Subsystem) Or Japan’s supply chain, which is known as a supplier of automotive components to enter a carmaker. Micron, Macron, Winbond, Spansion and others are all starting to compete in the semiconductor manufacturing plant. Micron and Spansion are pushing the new generation of memory specifications in an attempt to steal the car with electronic dominance. Wang Wang