在电子设备生产和维修中,常常需要进行元器件的脱焊操作。在此之前,已有几篇文章从不同的角度谈到这个问题。本文则是从另一角度介绍从高密度印制板上脱焊元器件的技术。首先讨论了高密度印制板的结构特点,然后论述了从高密度印制板上脱焊元器件的影响因素。连续真空抽锡系统是解决这些问题的最有效办法之一。因此,本文详细介绍了脱焊吸头的设计原则和选择,连续真空抽锡系统的作用原理和操作。最后列举了多引线双列直插式元件 In the production and maintenance of electronic equipment, it is often necessary to desoldering components. Until now, several articles have dealt with this issue from different perspectives. This article is from another point of view from the high-density PCB off the device components technology. First of all, the structural characteristics of high-density PCB are discussed, and then the influencing factors of desoldering components from high-density PCB are discussed. Continuous vacuum pumping tin system is one of the most effective solution to these problems. Therefore, this article details the design principles and options of the desoldering tip, the principle and operation of the continuous vacuum pumping tin system. Finally cited a multi-lead dual in-line components