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随着人类文明的进步,人们的环境意识正逐渐增强。保护自然环境,减少工业污染,已越来越受到人们的关注。SMT(表面贴装技术)生产作为电子生产的一部分,也不可避免地存在有对环境污染的问题。目前一些发达国家的科研机构正开展相关研究,寻找解决SMT生产污染问题的方法和途径,使SMT生产向绿色环保方向发展。目前在SMT生产过程中普遍采用的是锡铅焊锡,其中铅的含量在40%左右。众所周知铅是有毒的金属,将会对人体和周围环境造成相当巨大的影响。为了消除铅污染,采用无铅工艺已势在必行。90年代初,无铅工艺率先由美国提出。当
With the progress of human civilization, people’s environmental awareness is gradually increasing. Protection of the natural environment, reduce industrial pollution, more and more people’s attention. SMT (surface mount technology) production as part of electronic production, but also inevitably there is the issue of environmental pollution. At present, some scientific research institutions in developed countries are carrying out relevant research to find ways and means to solve the problem of SMT production pollution and make SMT production develop towards green environmental protection. Currently in the SMT production process is generally used in tin-lead solder, lead content of about 40%. It is known that lead is a poisonous metal and will have a considerable impact on the human body and the surrounding environment. In order to eliminate lead pollution, the use of lead-free process is imperative. The early 90s, lead-free technology first proposed by the United States. when