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采用一种新的液态合金表面张力测试方法测定了二元液态Ｓｎ－Ｐｂ钎料表面张力值随Ｓｎ含量及温度的变化关系，研究了添加微量Ｂｉ、Ｉｎ、Ａｇ元素在低Ｓｎ含量Ｓｎ－Ｐｂ钎料中的表面活性作用，指出Ｂｉ和Ｉｎ能显著地降低钎料合金系的表面张力，具有较强表面活性作用，而Ａｇ对钎料合金系表面张力值的降低作用较小，表面活性作用较弱。
The surface tension of binary liquid Sn-Pb solder with Sn content and temperature was measured by a new liquid alloy surface tension test. The effects of adding trace amounts of Bi, In and Ag on the Sn-Pb It is pointed out that Bi and In can significantly reduce the surface tension of the solder alloy system and have a strong surface activity, while Ag has little effect on the surface tension reduction of the solder alloy system. The surface activity Weaker.