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用热压烧结的方法制备了一种以金属间化合物MoSi2作为增强相的Cu基复合材料,并对其组织、力学性能和导电性能进行了研究。结果表明,MoSi2是一种合适的铜基复合材料的增强相,MoSi2/Cu复合材料具有良好的稳定性;MoSi2具有明显的细化晶粒强化基体的作用;随MoSi2含量的增加,MoSi2/Cu复合材料的密度和电导率下降,硬度和抗拉强度表现为先增加后降低;加入2%MoSi2时,复合材料具有最佳的综合性能,其相对密度和电导率分别为97.44%和68%IACS,硬度和抗拉强度分别为142HV和355MPa,是相同制备条件下纯铜硬度和抗拉强度的2倍多。
A Cu-based composite material with intermetallic compound MoSi2 as reinforcing phase was prepared by hot-pressing sintering. The microstructure, mechanical properties and electrical conductivity of the composites were studied. The results show that MoSi2 is a suitable reinforcing phase for Cu-based composites and the MoSi2 / Cu composites have good stability. MoSi2 has the obvious effect of refining grain-strengthening matrix. With the increase of MoSi2 content, MoSi2 / Cu The density and electrical conductivity of the composites decreased, while the hardness and tensile strength of the composites increased firstly and then decreased. When 2% MoSi2 was added, the composites had the best comprehensive properties. The relative density and electrical conductivity were 97.44% and 68% IACS, respectively , Hardness and tensile strength of 142HV and 355MPa, respectively, is the same preparation conditions, pure copper hardness and tensile strength of more than twice.